NTMS4873NF
Power MOSFET
30 V, 11.5 A, N ? Channel, SO ? 8
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Includes SyncFET Schottky Diode
? Optimized Gate Charge to Minimize Switching Losses
? SOIC ? 8 Surface Mount Package Saves Board Space
? This is a Pb ? Free Device
Applications
? Synchronous FET for DC ? DC Converters
? Low Side Notebook Non ? VCORE Converters
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter Symbol Value
Drain ? to ? Source Voltage
V DSS
Gate ? to ? Source Voltage
V GS
30
± 20
Unit
V
V
V (BR)DSS
30 V
http://onsemi.com
R DS(ON) MAX
12 m W @ 10 V
15 m W @ 4.5 V
N ? Channel
D
I D MAX
11.5 A
Continuous Drain
Current R q JA (Note 1)
Power Dissipation R q JA
(Note 1)
T A = 25 ° C
T A = 70 ° C
T A = 25 ° C
I D
P D
8.9
7.2
1.39
A
W
G
S
Continuous Drain
Current R q JA (Note 2)
Power Dissipation R q JA
(Note 2)
Continuous Drain
Current R q JA , t v 10 s
(Note 1)
Steady
State
T A = 25 ° C
T A = 70 ° C
T A = 25 ° C
T A = 25 ° C
T A = 70 ° C
I D
P D
I D
7.1
5.7
0.87
11.5
9.2
A
W
A
1
SO ? 8
CASE 751
STYLE 12
MARKING DIAGRAM/
PIN ASSIGNMENT
1 8
Source Drain
Source Drain
Source Drain
Gate Drain
Top View
Power Dissipation
R q JA , t v 10 s(Note 1)
Pulsed Drain Current
T A = 25 ° C
T A = 25 ° C, t p = 10 m s
P D
I DM
2.31
56
W
A
4873NF = Device Code
A = Assembly Location
Y = Year
Operating Junction and Storage Temperature
Source Current (Body Diode)
T J ,
T stg
I S
? 55 to
150
3.3
° C
A
WW = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
Single Pulse Drain ? to ? Source Avalanche Energy E AS
(T J = 25 ° C, V DD = 30 V, V GS = 10 V,
I L = 11 A pk , L = 1 mH, R G = 25 W )
Lead Temperature for Soldering Purposes T L
(1/8 ″ from case for 10 s)
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol
Junction ? to ? Ambient – Steady State (Note 1) R q JA
Junction ? to ? Ambient – t v 10 s (Note 1) R q JA
Junction ? to ? Foot (Drain)
R q JF
Junction ? to ? Ambient – Steady State (Note 2)
R q JA
60.5
260
Value
89.9
54.2
35.6
143
mJ
° C
Unit
° C/W
ORDERING INFORMATION
Device Package Shipping ?
NTMS4873NFR2G SO ? 8 2500/Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfacemounted on FR4 board using 1 sq ? in pad, 2 oz Cu.
2. Surfacemounted on FR4 board using the minimum recommended pad size.
? Semiconductor Components Industries, LLC, 2009
January, 2009 ? Rev. 1
1
Publication Order Number:
NTMS4873NF/D
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相关代理商/技术参数
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